Optimization of Reverse Engineering Processes for Cu Interconnected Devices
소개글Author: Koh Jin Won, Yang Jun Mo, Lee Hyung Gyoo, Park Keun Hyung
Organization: Koh Jin Won; Yang Jun Mo; Lee Hyung Gyoo; Park Keun Hyung
Publish: Transactions on Electrical and Electronic Materials Volume 14, Issue6, p304~307, 25 Dec 2013