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Design and Fabrication of a Low-cost Wafer-level Packaging for RF Devices

소개글 Author: Lim Jae-Hwan, Ryu Jee-Youl, Choi Hyun-Jin, Choi Woo-Chang Organization: Lim Jae-Hwan; Ryu Jee-Youl; Choi Hyun-Jin; Choi Woo-Chang Publish: Transactions on Electrical and Electronic Materials Volume 15, Issue2, p91~95, 25 Apr 2014
태그
  • Wafer-level packaging
  • Electrical through-connection
  • Highly productive process
  • Au-Sn bonding
  • Hermetic sealing