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Study of Via-Typed Air-Gap for Logic Devices Applications below 45 nm Node

소개글 Author: Kim Sang-Yong, Kim Il-Soo, Jeong Woo-Yang Organization: Kim Sang-Yong; Kim Il-Soo; Jeong Woo-Yang Publish: Transactions on Electrical and Electronic Materials Volume 12, Issue4, p131~134, 25 Aug 2011
태그
  • Via-typed air-gap
  • Trench-typed air-gap
  • Ultra low-k
  • Inter-dielectric layer
  • Effective dielectric constant